Wire bonding is the process of creating electrical interconnections between semiconductors (or other integrated circuits) and silicon chips using bonding wires, which are fine wires made of materials such as gold and aluminium. The two most common processes are gold ball bonding and aluminium wedge bonding.

CONVERTABILITY: WEST•BOND introduced the first triple convertible wire bonder back in November of 1969, today WEST•BOND introduces a new tool head that can bond it all: 45° wedge, 90° feed for wire and ribbon as well as ball bonding. A simple exchange of clamp assemblies, bond tool, and wire path provided with the software mode will allow

The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles.

8100 Wire/Ball Bonder. Taking fine wire bonding to new levels of productivity and efficiency for both operators and engineers. The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the

Hesse's latest generation of fully automatic wire bonders offer advanced ultrasonic bonding technologies for fine wire and heavy wire bonding applications.

Hughes 2470-V Palomar Automatic Wedge Wire Bonder Aluminum & Gold - Bad CMOS Bat Aluminum and Gold wire bonding Cycle Time: 750ms per wire with an approximate wire length of 0.025 inches Table Range: 5 x 12 inches Digital servos Looping: multiple 17438 SKU: 17438 Weight: 760.00 LBS. Was:

The wirebonder is designed for ultrasonic, thermosonic, or thermocompression wedge bonding of IC's, hybrids, microwave devices, and laser diodes using gold 

Ultrasonic Wire Bonder | We ULTRASONIC ENGINEERING CO.,Ltd, correspond to variety of field by applying Ultrasonic property to welding plastic and metal, 

Industry Leader in semiconductor wire bonder, die bonder, wedge bonder, pull test and bonder tools. Leader in manufacturing renowned line of wire bonding 

NEW SERIES WIRE BONDER. This series is an excellent tool for meeting the challenging bonding applications found in the RF, microwave, semiconductor, hybrid and medical device fields.

The bonder performs the second bond without tearing the wire as in step 8 of Semi/Auto mode bonding. The bonder then continues making bonds until you release the pushbutton. 2. After making one or more stitch bonds, release the STITCH pushbutton and make one more bond. The bonding head then rises to the Reset position and the wire tail is formed.

Wire Bonder manual Our HB05 gives you an easy access to the topic of bonding. Look, aim, bond - done. 17μm to 75μm Wire gold, aluminum, silver & copper wire One Bond Head wedge, ball, bump & ribbon bonding Light Weight weighs in total only 29kg Compact Design smooth and easy use 4" TFT fast and easy control of all bonding parameters

Wire bonders are used to make several package types. Each package has a different number of bond wires with various wire lengths, loops, and 

Description: Wire bonding is the method of interconnecting between device to device, device to package, or device to printed circuit board. Wire bonding is 

05/08 · Developed in the 1950s, a wire bonder resembles a hi-tech sewing machine that stitches one chip to another chip or substrate using tiny wires. Wire bonding mainly has been used for low-cost legacy packages, mid-range packages, memory die stacking and others. Fig. 1: Ultra fine pitch wire bonding. Source: Kulicke & Soffa.

The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder with optional interchangeable clamps for 45-60° and 90° deep access bonding on a 

DRAHTBONDER für die Entwicklung und Produktion von Mikrochips sowie DIE-BONDER / Chip-Bonder zum Platzieren von Mikrochips.

Innovative Industry-Leading Ball Bonding Solutions. Kulicke & Soffa's ball bonders are the leading generation of semiconductor assembly equipment for today's most challenging applications. With our long-standing tradition of innovation and technology leadership, the K&S ball bonders set new standards for performance, productivity, reliability

HB05. Manual Wire Bonder. ​. Ideal for laboratories and pilot production lines. Wedge, Ball, Bump and Ribbon bonding. 17µ to 75µ Wire & 25µ x 250µ Ribbon.

The MPP iBond5000 Wire Bonder series is based on the proven 4500 Series, the market leader for nearly a decade, and used mainly for Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.

Automatic Wire Bonders ESEC 3100 Ball-Wedge Bonder Specifications Ultrasonic frequency: 130 kHz Flying bondhead Fixed electrode (EFO currents upto 400 mA)