Bonding single wires with TPT's HB100 automatic wire bonder.For more information visit: https://www.tpt-wirebonder.com/hb100/

Manual DIE-bonding with Touchdown-Detection and programmable pickup- and bond force 2 x 2" working area for any Waffle-, Gel-Packs or Trays Bond- and pickup force from 5 up to 500 cN programmable Get Your Quote Semi-Automatic Wire Bonders Series 56 - Flexible, automatic and unique If you need 1,000 to 10,000 wirebonds per day

The HB05 manual series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.. An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

K&S Launches ULTRALUX™ Automatic Wire Bonder. ULTRALUX™ is the latest generation ball bonder utilizing the latest technologies and materials that will save LED manufacturers up to 10% capital cost. Learn More News. Discover recent K&S news and stories. View All News. Kulicke & Soffa Collaborates with LeYu Precision to Deliver Production

This chapter describes the K&S 4500 Series Manual Wire Bonders controls and indicators. 1.1 The Multi Mouse The Multi Mouse is located on the base either to the right or the left of the workholder table. The Multi Mouse has two functions: Control of the bonding cycle. Fine positioning of the bonding pad under the wedge/capillary.

Model 7400D Series, Wedge-Wedge Wire Bonders, Manual X-Y-Z Overview Year 2000 saw the "C" Series finally replace the venerable "A" Series, and now witnesses the transition accepts the new tool assemblies of the wire bonders as well as other cast-body tool assemblies. The angled wedge wire bond configuration is shown below.

The wire bonders from F&S Bondtec offer the best quality and an unbeatable price-performance ratio. Characteristic of all our wire bonders are quick and easy 

F&S Bondtec offers the perfect development machine with its manual wire bonder. Simple operation, extremely adaptable bonding settings, at an unbeatable price-performance ratio. - Complete, manual table top bonder - Unbeatable price-to-performance ratio - Extremely adaptable bond settings, loop shapes, force and power profiles etc.

The Model 4526 Auto-Stepback Wedge Bonder is used with aluminum wire, gold wire and. ribbon. It is especially appropriate for your high quality applications requiring tight control of. wire

Search for used manual wire bonder. Find Kulicke & Soffa, West Bond, Hughes, Palomar, and Orthodyne for sale on Machinio.

An advanced manual wire bonder for gold ball bonding or bumping (copper optional). More Convertible wire bonder between wedge or ribbon bonding and ball bonding with deep access wire feed. Legacy K&S Manual Wire Bonders Fully refurbished 2nd user Kulicke and Soffa (K&S) manual ultrasonic gold ball and wedge wire bonding equipment. More

5. Semi-Auto Bonding 6. Manual Z Bonding 7. Spotlight Adjustment 8. Standard Wedge Tool and Wire Specifications for Au Wire Configuration . CRITICAL PRECAUTIONS AND COMMON MISTAKES • Keep hands out of the working a rea while the Bonding Tool is in operation • Be aware of high temperature of the work holder and use tweezers when placing the

We specialize in the sales, service and training of quality refurbished Wire Bonders, Die Bonders and Saws. We are certified by Bausch and Lomb (Lieca) to service microscopes. We offer repair services for Kulicke and Soffa Manual Wire Bonder logic boards along with the entire 4100 machine series and 4500 machines;

MANUAL WIRE BONDER Results 1 to 3 of 3. West-Bond 7700D Manual Ball-Wedge Wire Bonder: Active. Make: Westbond Model: 7700D Location: U.S.A. Wire & Die Bonder in Semiconductor Equipment Posted by: ollie : Hughes Palomar 2460V wedge Bonder: Active. Make: Hughes Palomar 2470V Model: 2470V

K&S is the leader in wire and ribbon bonding for power semiconductors, automotive power modules, and industrial power hybrids. K&S wedge bonders ultrasonically bond round aluminum wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminum ribbons from 500 x 100 to 2000 x 300 microns in cross-section

K&S 4524 Digital Ball-Wedge Bonder Application Gold wire (25µm - 50µm diameter) ball-wedge bonding K&S 4523A Digital Wedge-Wedge Bonder Application Aluminum 

With over 30 years of wire bonding experience the current range of MPP manual wire bonder’s include the i5000B Ball Bonder, i5000W Wedge Bonder and i5000D Dual Bonder, which has both ball bonding and deep access wedge bonding capabilities. The equipment is used for process development, production or research of microelectronic and related

Manual Wire Bonders / Optional Die Bonder. Series 53 - Small, Manual, Easy; If you need 1 to 100 bonds per day; Complete, manual table top bonder 

The TPT HB16 Wire bonder is a manual/semi automatic ultrasonic wire bonder with motorized Z- and Y-axes, as well as precise manual control of sample 

5) Ball bonding, bumping, coining, security bond and tab. 6) Semi-automatic/manual mode with Z option. Safety. The sample stage is hot, default at 150 oC.

WIRE BONDER for the development and production of microchips and DIE BONDER for placing microchips. Wire Bonder. HB05; HB10; HB16; HB100; HB30; Overview; Die Bonder. HB75; H80;